Advantages

  • High efficiency by latest 7th Gen. IGBT Technology
  • High Reliability by improved thermal cycle capability with SLC-Technology
  • Pre applied PC-TIM available
  • Optional press-fit or solder pin terminals available for optimized assembly processes
  • 36% higher power density
  • High temperature operation with Tvjmax = 175˚C junction temperature at overload events

Attributes

Ratings:

650 V: 50 A, 75 A, 100 A
1200 V: 35 A, 50 A, 75 A

Dimensions [mm]:

54 x 107.5 x 17

3D-Model

Videos

7th gen NX- and std-type IGBT modules: A solution for industrial applications