7^th Gen. IGBT NX-type 2-in-1 Module

Advantages

• High efficiency by latest IGBT Technology
• High Reliability by improved thermal cycle capability with SLC-Technology
• Pre applied PC-TIM available
• Optional press-fit or solder pin terminals available for optimized assembly processes
• High temperature operation with Tvjmax = 175˚C junction temperature at overload events
• Mechanically Compatible SiC MOSFET Modules available

Attributes

650 V: 300 A, 450 A, 600 A

1200 V: 225 A, 300 A, 450 A, 600 A, 800 A, 1000 A

1700 V: 225 A, 300 A, 450 A, 600 A

62 x 152 x 17