Advantages

  • Extra-compact, scalable, high reliability transfer-molded 2-in-1 package
  • High reliability Direct Lead Bonding (DLB) wire bond less package for automotive inverters
  • Low power loss RC-IGBT
  • Integrated on-chip temperature & current sensors
  • Pb-free structure, compliant with RoHS directive (2011/65/EU)

Attributes

Ratings:

750V: 400A

Dimensions [mm]:

27 x 54 x 7

Downloads

3D-Model

Presentations

Videos

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J3-Series: High Power-Density, High-Reliability, Scalable SiC and Si Power Modules for E-Mobility

J3-Series: High Power-Density, High-Reliability, Scalable SiC and Si Power Modules for E-Mobility