Advantages

  • Extra-compact, scalable, high reliability transfer-molded package (Bidirectional & Unidirectional relay topologies)
  • High reliability Direct Lead Bonding (DLB) wire bond less package
  • Foot-print compatible with J3-T-PM half-bridge modules for automotive
  • Low power loss Trench SiC MOSFET
  • Integrated Multi-Function-Chip for temperature-sensing and rapid SC protection
  • Pb-free structure, compliant with RoHS directive (2011/65/EU)

Attributes

Ratings:

1300V: 250 A / 350 A

Dimensions [mm]:

27 x 54 x 7

Downloads

Presentations