Flyer: SOPIPM™ surface-mount package IPM
Flyer: T-Series IGBT Modules – NX-Type
Flyer: T-Series IGBT Modules – Standard-Type
Flyer: Power Modules for High Frequency Applications
Flyer: LV100 optimized for Renewable and Industrial Applications
Flyer: J1-Series for Automotive Applications
Flyer: SLIM package Intelligent Power Module (SLIMDIP™) for Consumer Goods Applications
Flyer: LV100 and HV100 X-Series High-Voltage Power Modules
Flyer: X-Series High-Voltage IGBT Modules
Flyer: DIPIPM+ Intelligent Converter-Inverter-Brake Modules
Flyer: G1 Series IPM Modules
Flyer: Super Mini Full SiC DIPIPM ultra-small compact Transfer Molded Intelligent Power Module
Mitsubishi Electric Power Devices 2021
Mitsubishi Electric HVIC 2021
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Mitsubishi Electric Europe B.V.
Semiconductor European Business Group
Mitsubishi-Electric-Platz 1
D - 40882 Ratingen
Phone: +49 (0) 2102 / 486 – 0
Fax: +49 (0) 2102 / 486 – 4140
E-Mail: semis.info@meg.mee.com
Internet: www.meu-semiconductor.eu