PCIM 2023

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09 – 11 May 2023

PCIM Europe 2023

The global transformation towards energy conservation and decarbonization is the key responsibility of our generation.Improved energy efficiency is a priority – along with increased use of renewables in transport, industry, buildings, and other areas. With its Green Deal, the European Union has already committed to becoming the first climate-neutral continent by 2050.

Power semiconductors are a key component on the way towards decarbonization.  At Mitsubishi Electric Semiconductor, we are strongly committed to contributing  to this transformation: Investments in a new 8-inch Silicon Carbide (SiC) wafer plant and enhance related production facilities as well as new product developments are underlining this.

You can build on it.

Come and discover it at PCIM Europe 2023.

Find us on PCIM

Hall 7, Booth 419

Link to fairplan

Please click on the image to get to the exhibition plan.


Oral Presentations

Date and Time
Title / Description
Tue, 09/05/2023 14:00
SiC Device Technology:
Prediction of the Bipolar Degradation in 1200V 4H-SiC MOSFETs by Inspection in Device Fabrication Process
Kazuya Ishibashi, Mitsubishi Electric, J
Stage: Brüssel 1
Tue, 09/05/2023 14:20
SiC Device Technology:
Improved Short Circuit Ruggedness by Optimization of Sidewall P-type Pillar Ratio for Trench SiC-MOSFET Fabricated by Multiple Tilted Ion Implantation into Trench Sidewalls
Yutaka Fukui, Mitsubishi Electric, J
Stage: Brüssel 1
Wed, 10/05/2023 10:10
Advanced IGBT's and Modules:
RC-IGBT Module Suitable for Motion Control
Nobuchika Aoki, Mitsubishi Electric, J
Stage: Brüssel 2
Wed, 10/05/2023 10:30
Advanced IGBT's and Modules:
4.5 kV HV100-type HVIGBT Module for Large Industrial Equipment
Kazuto Mikami, Mitsubishi Electric, J
Stage: Brüssel 2

Poster Presentations

Date and Time
Title / Description
Tue, 09/05/2023 15:05
Packaging for SiC Devices:
A05-8549: Advanced PKG Technology for SiC in the NX Package
Ryo Goto, Mitsubishi Electric, J
Foyer Entrance, NCC Mitte
Thu, 11/05/2023 11:10
J01-7010: Device Model of CSTBT with Highly Dosed Carrier Density in CS Layer
Toshiya Tadakuma, Mitsubishi Electric, J
Foyer Entrance, NCC Mitte

Recent News

Find out more about our PCIM related news

Next generation automotive module concept providing RC-IGBT and SiC solutions

Since 1997, Mitsubishi Electric pioneered the mass production of power devices for hybrid and electric vehicles with a proven track record of more than 25 Million xEVs on the road.

At PCIM Europe discover our next generation automotive module concept, which is applicable to various configurations such as 6in1 integrated module and 2in1 flexible design module. You can realize a full lineup with reliable transfer molded power module cores providing both RC-IGBT and SiC solutions in the same package for hundreds of kilowatts of scalable power.

Mitsubishi Electric’s next generation dual package with 4.5 kV X-series

Power semiconductors are increasingly being utilized to efficiently convert electric power in order to lower the carbon footprint of global society, particularly in heavy industry, where these devices are used in power-conversion equipment such as inverters in railway traction systems and for DC power transmission.

For such application Mitsubishi Electric’s high-voltage IGBT (HVIGBT) power modules offer high withstand voltage, high current density, and low loss characteristics. The main goal is to increase output power and efficiency of inverter systems.

Mitsubishi Electric is enhancing the next generation dual package X-series with the 4.5 kV HV100 module. It is characterized by a 24% higher current density compared to the conventional X-series package and a 12% higher output current.

Find out more details about the 4.5 kV HV100 module in our recent press release: https://www.meu-semiconductor.eu/wp-content/uploads/2023/04/0425.pdf

Also do not miss the oral presentation at the PCIM Europe conference about this “4.5 kV HV100-type HVIGBT Module for Large Industrial Equipment” on Wednesday, 10th, at 10:30 on stage “Brüssel 2”.

09.05.2023 – 12:55-13.15

Efficient Home Appliance – DIPIPM Product Family

Visit our presentation on the Exhibitor Stage (Hall 9, Booth 551) and take a deep dive into our DIPIPM Product Family. You can find us on our booth (Hall 7, Booth 419) after the presentation for further information and discussion.

Akiko GOTO
Senior Manager
Marketing and Application Engineering Sect. C Product Strategy Dept.


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Mitsubishi Electric Europe B.V.
Semiconductor European Business Group
Mitsubishi-Electric-Platz 1
D - 40882 Ratingen

Phone: +49 (0) 2102 / 486 – 0
Fax: +49 (0) 2102 / 486 – 4140

E-Mail: semis.info@meg.mee.com
Internet: www.meu-semiconductor.eu