3rd Gen RC-IGBT Bare Dies

Advantages

• Optimized Chip Utilization and Module Miniaturization
• Improved Heat Dissipation Through Chip Integration
• Electrical Performance Gains Through Simplified Internal Wiring
• Reduced Cost specially for Shorter Range Vehicles
• Advanced Technology Integrated in the 3rd Gen. RC-IGBT to Enhance Efficiency and Reduce Losses
• Equipped with On-Chip Temperature Sensing Diode and On-Chip Current Sensing

Attributes

750 V: 400 A
750 V: 560 A

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