• Cutting edge MCB baseplate for high reliability and high power density
  • Increased humidity robustness
  • High flexibility by easy parallel connection
  • Three AC terminals for high current capability
  • Maximum gate-driver design space with clean auxiliary terminal placement
  • Future prove design and Ready-for-SiC



1700 V: 1200 A
3300 V: 450 A, 600 A

Dimensions [mm]:

100 x 144 x 40



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Low inductive, future-proof high-voltage LV100 and HV100 dual modules for great flexibility